BASiC Semi to build $28 million packaging line
Semiconductor power device maker Shenzhen BASiC Semiconductor Co. Ltd. (9971.HK) said Tuesday that it will invest 193.3 million yuan ($28 million) to build a silicon carbide module packaging production base, and has signed a construction contract.
Located in Shenzhen’s Pingshan district, the project features two buildings with factory premises, offices and dormitories, covering a total gross floor area of 59,400 square meters.
The company said the new complex is part of its future operational strategy, providing capacity for sectors such as new energy vehicles (NEVs), intelligent computing centers and photovoltaic energy storage.
Shares of BASiC Semiconductor opened flat at HK$56.95 on Tuesday. The stock is up more than 80% since its trading debut earlier this month.
By Lau Chi Hang
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