BRIEF: Tianyu Semiconductor slides in Hong Kong trading debut
Guangdong Tianyu Semiconductor Co. Ltd. (2658.HK), a silicon carbide epitaxial wafer maker, slid in its Hong Kong trading debut on Friday, opening 34.5% lower at HK$38 before narrowing its losses…
BRIEF: Nsing Technologies gets China’s regulatory nod for Hong Kong listing
Chip designer Nsing Technologies Inc. (300077.SZ) has been approved by China’s securities regulator for a Hong Kong IPO, paving the way for the company to list in the city. The…
China Int’l Development ditches leather for power semiconductors
The leather goods maker has signed an MOU to acquire power semiconductor maker Lonten, after an earlier deal to invest in a blockchain company collapsed Key Takeaways: China International Development…
Yangtze Memory overhauls share structure in preparation for IPO
China’s leading memory chip maker was worth $23 billion after its recent shareholding overhaul, and is likely to list in either Shanghai or Shenzhen Key Takeaways: YMTC has completed a…
BRIEF: SICC launches $260 million IPO
Semiconductor company SICC CO. Ltd. (2631.HK; 688234.SH) launchedits Hong Kong IPO on Monday, planning to issue 47.7 million shares at up to HK$42.80 per share to raise up to HK$2.04…
Moore Threads taps China IPO investors as it faces challenges, opportunities
The GPU maker hopes to benefit from China’s drive to develop its domestic chip industry, as it navigates growing obstacles from U.S. sanctions Key Takeaways: Moore Threads has filed for…
BRIEF: Tianyu Semiconductor gets CSRC nod for Hong Kong IPO
Silicon carbide (SiC) wafer maker Guangdong Tianyu Semiconductor Co. Ltd. received an approval notice from the China Securities Regulatory Commission (CSRC) last Friday for its plan to list in Hong…
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